Elpida announced on June 22, 2011 that the company has developed a DRAM (Dynamic Random Access Memory) package that is 20% thinner than similar existing packages found in the market, according to a June 22, 2011 report by the Wall Street Journal. It is reported that the 1-gygabyte package, containing four stacked chips, is 0.8 millimeter thick. The package is said to design for Smartphones and tablet devices. Volume production and shipment are slated to begin in the third quarter of 2011.